Metal injection molding material with high aspect ratio filler
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United States of America Patent
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N/A
Issued Date -
Dec 6, 2001
app pub date -
Jan 10, 2001
filing date -
Jan 11, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention discloses a conductive injection molding composition. The thermally conductive composition includes a metallic base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. In addition, an alternative embodiment of the composition mixture includes a second thermally conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.
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