High frequency component, communication apparatus, and method for measuring characteristics of high frequency component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Dec 13, 2001
app pub date -
Feb 28, 2001
filing date -
Feb 29, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A high frequency component is constructed such that the characteristics of a high frequency circuit that cannot be measured only by an outwardly extending terminal electrode are easily measured at the final-product stage. In the high frequency component, a substrate has an electrode pattern provided including a signal measuring electrode pad. Additionally, chip components are mounted on the substrate. A metal cover has a hole provided near the signal measuring electrode pad. Through the hole, a probe of a measuring apparatus is inserted from the outside to abut with the electrode pad. With the arrangement, a voltage signal obtained at a predetermined point of the high frequency circuit is measured.
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