Thin film encapsulation of organic light emitting diode devices

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United States of America Patent

APP PUB NO 20010052752A1
SERIAL NO

09784378

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Abstract

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The present invention is directed to an OLED display device including an encapsulation assembly and methods for making such devices. The encapsulation assembly includes at least two layers, one of which is a dielectric oxide layer directly in contact with at least part of a substrate, and the other of which is preferably a polymer layer.

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Patent Owner(s)

Patent OwnerAddress
EMAGIN CORPORATION700 SOUTH DRIVE SUITE 201 HOPEWELL JUNCTION NY 12533

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ghosh, Amalkumar P Poughkeepsie, NY 70 1387
Howard, Webster E Lagrangeville, NY 14 1368
Jones, Gary W Lagrangeville, NY 63 2740

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