ELECTROPLATING OF METALS USING PULSED REVERSE CURRENT FOR CONTROL OF HYDROGEN EVOLUTION
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 27, 2001
app pub date -
Jun 9, 1997
filing date -
Jun 9, 1997
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Excessive evolution of hydrogen in electrolytic deposition of metals on a cathode substrate can be controlled by using a pulsed reverse current. Reverse current pulses interposed between the forward current pulses consume at least some of the nascent hydrogen and prevent the local pH at the cathode surface from becoming excessively alkaline. Control of hydroxide ion concentration by pulsed reverse current alleviates problems caused by reaction of metal-bearing-ions with hydroxide ions generated near the cathode by evolution of hydrogen. The method is useful in depositing functional chromium coatings on electrically conductive substrates from plating baths comprising aqueous solutions of trivalent chromium salts. In such a method the current comprises forward pulses having a duty cycle of from about 50% to about 90% and reverse pulses having a duty cycle of from about 5% to about 30%, and a frequency of from about 5 Hz to about 700 Hz.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully