Semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Dec 27, 2001
app pub date -
Jun 1, 2001
filing date -
Jun 2, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor device in which a plurality of semiconductor chips are stacked and fastened to a lead frame. First bonding points on the semiconductor chips and second bonding points on the leads of the lead frame are connected by trapezoidal loop shape wires which differ from each other in height, each of the wires comprising a neck portion which rises from the first bonding point, a trapezoidal portion which is continuous from the neck portion, and an inclined portion which is continuous from the trapezoidal portion, inclined toward the second bonding point and bonded to the second bonding point; and a bent portion is formed in at least a lowermost wire.
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