Probe card and a method of manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Dec 27, 2001
app pub date -
Jun 6, 2001
filing date -
Jun 21, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In a probe card for testing a plurality of semiconductor integrated circuits formed on a semiconductor wafer in a lump, only a faulty probe can be repaired without removing all probes from a wiring board. The probe card comprises a plurality of probes to be connected to respective testing electrodes formed on the semiconductor wafer, and wiring means provided with pads to be jointed to the probes, wherein the pads is formed on the upper surface of the wiring board.
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