Contact probe and fabrication method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20020000821A1
SERIAL NO

09870420

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Abstract

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A contact probe is fabricated by a method including a lithography step and a plating step. The contact probe includes a plunger unit to form contact with a circuit to be tested, a spring unit, and a lead wire connection unit, all formed integrally so as to have a three dimensional configuration with uniform thickness with respect to a predetermined plane configuration in a thickness direction perpendicular to the predetermined plane configuration. Preferably, a guide unit parallel to the spring unit is also formed integrally. Further preferably, the contact probe is formed integrally also including a stopper for each unitary configuration of the spring unit constituted by a leaf spring.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBAKAWASAKI
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haga, Tsuyoshi Ako-gun, JP 31 288
Hayasaka, Nobuo Yokosuka-shi, JP 81 3373
Matsunaga, Noriaki Chigasaki-shi, JP 67 1676
Okumura, Katsuya Tokyo, JP 337 7835
Shibata, Hideki Yokohama-shi, JP 90 1823

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