Low loss material for the manufacture of PCB'S and antenna boards and a method for producing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
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app pub date -
May 17, 2001
filing date -
Jun 22, 2000
priority date (Note) -
Abandoned
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Abstract
A method of manufacturing a low loss printed circuit board material including the steps of: providing a substrate comprising at least one layer of cross-linked polyethylene, providing a conducting foil, bringing a surface of the foil together with a surface of the substrate, casting a bonding layer of molten polyethylene between the surfaces, laminating the foil onto the substrate and cross-linking the bonding layer.
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Cited Art Landscape
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