Surface mount package for long lead devices
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United States of America Patent
Stats
-
Jul 23, 2002
Issued Date -
N/A
app pub date -
Sep 10, 2001
filing date -
Sep 21, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Via holes are plated through the substrate of a surface mount package. The leads of an electronic device is inserted in the plated-through via holes. The bottom of the plated through metal is enlarged as pads to provide reliable soldering surfaces to a motherboard. Upon heating the leads are soldered to the walls of the plated through via holes. Alternatively, the leads can be folded before inserting into the plated-through via holes.
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