US Patent Application No: 2002/0005,958

Number of patents in Portfolio can not be more than 2000

Non-contact thickness-measuring device

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Abstract

Disclosed is a non-contact type of thickness-measuring device for determining the thickness of a workpiece to be machined. It comprises: a laser light projecting means for projecting a ray of laser light to the top surface of the workpiece at a predetermined angle of incidence relative to the top surface of the workpiece; an imaging means for capturing the first ray of laser light reflected from the top surface of the workpiece and the second ray of laser light passing through the workpiece and reflecting from the bottom surface of the workpiece; and an arithmetic means for determining the thickness of the workpiece from the distance between the first point at which the first ray of laser light falls on the imaging means and the second point at which the second ray of laser light falls on the imaging means.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
DISCO CORPORATIONTOKYO360

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sekiya, Kazuma Tokyo, JP 108 221

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
TOKYO SEIMITSU CO., LTD. (2)
7,601,615 Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus 2 2006
8,152,597 Wafer grinding method and wafer grinding machine 0 2009
 
ALLIANCE FOR SUSTAINABLE ENERGY, LLC (1)
7,238,912 Wafer characteristics via reflectometry and wafer processing apparatus and method 0 2004