PROCESS AND DEVICE FOR THE HEAT TREATMENT OF SEMICONDUCTOR WAFERS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 24, 2002
app pub date -
Aug 23, 1999
filing date -
Aug 27, 1998
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A process for the heat treatment of semiconductor wafers, preferably monocrystalline ultrapure silicon wafers, using an upper and a lower heat source, which can be a plurality of upper and a plurality of lower lamps or banks of lamps. In the process chamber of an RTP system, the heat treatment is carried out on at least two wafers which are arranged parallel above one another, spaced apart, and are identical in terms of geometrical dimensions and thermal material properties.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully