High performance thermal/mechanical interface for fixed-gap references for high heat flux and power semiconductor applications
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United States of America Patent
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Issued Date -
Feb 7, 2002
app pub date -
Jul 20, 2001
filing date -
Jul 20, 2000
priority date (Note) -
Abandoned
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Abstract
? A thermal mechanical interface usable between a heatsink and a heat dissipating device is disclosed. In one embodiment, the thermal mechanical interface comprises a thermally conductive mechanically resilient member having a corrugated cross section and a first thermal conductance, disposed between the heat sink and the heat dissipating device and a thermal interface material having a second thermal conductance, disposed within the corrugated cross section.
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