Vialess printed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 12, 2002
Grant Date -
Feb 14, 2002
app pub date -
Jun 22, 2001
filing date -
Jun 26, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method is disclosed for establishing signal contacts on a multilayer printed circuit board having alternating ground and signal layers in a stack-up configuration. The signal layers have signal pads and conductive traces leading away from the pads. The method comprises the steps of: a) drilling blind signal holes in the printed circuit board down to signal pads on successive signal layers, b) filling the blind signal holes with conductive material, and c) removing strips of the printed circuit board nearly down to successive signal layers to provide on each signal layer a strip of exposed signal contacts for the conductive traces thereon.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully