Insert molded heat sink assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Feb 14, 2002
app pub date -
Jan 10, 2001
filing date -
Jan 11, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An insert molded heat sink assembly for dissipating heat from a heat generating source includes a polymer base that contacts the heat generating source with a heat dissipating element array embedded therein. A pin grid array, fins or other structures are embedded directly into the polymer base using a molding process. In accordance with the present invention the heat dissipating elements are insert molded around to produce a completed heat sink. Moreover, the polymer base is preferably a highly thermally conductive polymer composition. Also, the geometry of the heat dissipating members, such as a pin or fin array, is optimized to improve the overall performance of the heat sink assembly.
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