High speed flip chip assembly process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Feb 21, 2002
app pub date -
Apr 4, 2001
filing date -
Apr 4, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method is provided to assemble flip chips to an electronic circuit using a printable anisotropic conductive adhesive or paste. The invention is especially useful to assemble flip chips or other components to an array of circuits provided within a large area format. The circuits in a preferred embodiment are disposable radio frequency identification devices (RFID) or Smart Cards.
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Cited Art Landscape
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