Electrical component assembly and method of fabrication
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 7, 2002
app pub date -
Mar 19, 2001
filing date -
Jul 21, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An electrical component assembly and method for the fabrication of the assembly in which particles are affixed to metal contact surfaces and pressure is applied to cause the particles to penetrate into at least one of the metal contact surfaces. In one method, hard particles are applied to one of the metal surfaces by electroplating the particles in a plating bath. In another method, the hard particles are applied to a non-conductive adhesive layer positioned between an electronic component and a substrate. Once pressure is applied to either the electronic component on the substrate, a permanent, electrically conductive bond is formed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully