Apparatus and method for handling and testing of wafers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Mar 28, 2002
app pub date -
Jul 25, 2001
filing date -
Aug 8, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Embodiments provide an apparatus and method permitting the handling of a semiconductor wafer while maintaining the vacuum applied to the relevant wafer handling equipment continuously in an actuated state. These embodiments provide more gentle wafer handling with reduced contamination risk. One embodiment provides a passive end effector. Another embodiment provides a holder, for an object such as a semiconductor wafer, that utilizes Bernoulli-type forces to retain the object against the holder.
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