Contact structure for connecting two substrates and also process for producing such a contact structure
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United States of America Patent
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N/A
Issued Date -
Apr 11, 2002
app pub date -
Dec 13, 2001
filing date -
Aug 8, 1997
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A contact structure (10) and a process for producing a contact structure are provided for connecting two substrates (11, 12). The process includes applying solder material (23) to terminal areas (16) of a first substrate (11) to form spacing metallizations (19), and bonding of the first substrate (11) with a second substrate (12). The bonding between the terminal areas (16) of the first substrate (11) and a contact surface area of the second substrate (12) is performed by means of an electrically conductive adhesive compound (20).
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