Robotic end effector for semiconductor wafer processing
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United States of America Patent
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N/A
Issued Date -
Apr 11, 2002
app pub date -
Jul 10, 2001
filing date -
Jul 10, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed are robotic end effectors used for handling thin media such as semiconductor wafers during processing, including methods and apparatus for replaceably retaining a plurality of standoff pads in the end effectors.
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