Method for conditioning polishing pads
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United States of America Patent
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N/A
Issued Date -
Apr 11, 2002
app pub date -
Sep 28, 2001
filing date -
Oct 2, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for conditioning a polishing pad includes, pressing a conditioning surface of a conditioning pad comprising a first polymer against a polishing surface of the polishing pad comprising a second polymer, and producing relative motion between the pads such that measured characteristics of the polishing surface are changed.
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