Method for chemical-mechanical-polishing a substrate
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United States of America Patent
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-
N/A
Issued Date -
Apr 18, 2002
app pub date -
Mar 22, 2001
filing date -
Mar 23, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of polishing a surface of a substrate wafer wherein slurry is recycled back to the interface between the polishing pad and the substrate surface during the polishing and newly-formulated slurry is supplied to the interface during the last stages of polishing. The method includes the application of a first slurry during the removal of first surface portion of the substrate, where at least a portion of the first slurry is recycled polishing slurry. At a predetermined transition point, the first slurry is replaced with a newly-formulated slurry and the newly-formulated slurry is applied to remove a second surface portion of the substrate.
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