Radiating enclosure
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United States of America Patent
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-
May 13, 2003
Grant Date -
Apr 25, 2002
app pub date -
May 21, 1999
filing date -
May 21, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated radiating enclosure is disclosed. The enclosure housing is formed from a dielectric material with a radiating element formed on the exterior surface of the housing and a groundplane material formed on the interior of the housing. The groundplane provides EMI shielding for the enclosed electronics. The three antenna elements are directly connected to the circuitry of a transceiver system, thereby integrating the transceiver antenna components directly into the transceiver enclosure.
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