Polymeric substrate circuit protection device and method of making the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20020058208A1
SERIAL NO

09968209

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention discloses a polymeric circuit protection device and a method of making the same, wherein a highly conductive composite material and a conductive composite material of positive temperature coefficient thermal sensitive resistance are alternately stacked to form a plaque-shaped composite material, then two metal foils are laminated on top surface and bottom surface of the plaque-shaped composite material as electrodes to thereby form a sandwich-like laminated material. Moreover, a cross-linking process is made to cross-link the resin inside the composite material layer. Electrode trenches are etched, and an insulating layer is formed by using green paint in the electrode trenches to isolate different electrodes on the same surface of the device. The highly conductive composite material has more than twenty times the conductivity of the conductive composite material so as to ensure that among connected electrodes inside the plaque-shaped composite material, current mainly flows through the highly conductive composite material rather than the conductive composite material of positive temperature coefficient thermal sensitive resistance.

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Patent Owner(s)

Patent OwnerAddress
PROTECTRONICS TECHNOLOGY CORPORATION5 LANE 17 YEN-KU ST TAOYUAN CITY R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chih-Yi Yuanlin Town, CN 19 59
Chen, Rei-Yian Hsin-Shih Village, TW 5 22
Hwang, Ren-Haur Taoyuan City, TW 6 33
Lin, Chen-Ron Hsinchu City, TW 8 40

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