Chemical mechanical polishing of dielectric materials
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 16, 2002
app pub date -
Sep 26, 2001
filing date -
Oct 2, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor wafer has, an underlying dielectric layer with non-planarity features at its surface due to damascene topology, and a successive dielectric layer that is without damascene topology overlying the first dielectric layer, the successive dielectric layer having a smooth polished planar surface that minimizes cumulative non-planarity. The surface is polished by chemical-mechanical planarization with a reactive liquid borne by an aqueous polishing fluid applied at an interface of the successive dielectric layer and a polishing pad.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully