Semiconductor polishing pad
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
May 16, 2002
app pub date -
May 3, 2001
filing date -
May 3, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A belt has a polishing pad with one or more polishing pad sections joined to the belt by an adhesive layer. A seam joint is reinforced with caulking material. Edge portions of the seam joint are beveled or dovetailed. Parallel stress relief grooves in the upper surface of the polishing pad prevent delamination of the polishing pad from the belt.
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