Light-transmissive epoxy resin composition and flip-chip type semiconductor device
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United States of America Patent
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Issued Date -
May 16, 2002
app pub date -
Sep 12, 2001
filing date -
Sep 12, 2000
priority date (Note) -
Abandoned
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Abstract
A light-transmissive epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler satisfies formula (1): [{2(n.sub.A.sup.2+n.sub.C.sup.2)-(n.sub.A+n.sub.C).sup.2}/2].sup.1/2<3.-0.times.10.sup.-3 (1) wherein n.sub.A is the refractive index at 25.degree. C. of the cured product of the unfilled composition, and n.sub.C is the refractive index at 25.degree. C. of the inorganic filler. The cured composition has improved heat resistance, humidity resistance and low stress as well as high transparency. The composition is suited for use as an underfill for flip-chip type semiconductor devices for optical communications.
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