Polishing composition
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
May 30, 2002
app pub date -
Aug 9, 2001
filing date -
Aug 11, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A polishing composition for chemical mechanical polishing of semiconductor wafers having a copper metal circuit includes, an aqueous composition having a pH of under 5.0, and polyacrylic acid having a number average molecular weight of about 20,000-150,000, or blends of high and low number average molecular weight polyacrylic acids.
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