Flat package for semiconductor diodes
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
May 30, 2002
app pub date -
Jan 23, 2002
filing date -
Jun 19, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Two flat contact pads form a portion of the bottom surface of a flat package and constitute the two external connections for a light emitting diode. The diode rests on at least one the contact pads. The LED and the contact pads are covered with protective glue. The protective glue can be a phosphorescent or decorative material to change the color of the light emitted from the LED. If the diode has one electrode at the bottom surface, the contact pad not in contact with diode is wire bonded to the top electrode. If the diode has both electrodes at the bottom surface, the two electrodes can rest on two separate contact pads. If the diode has both electrodes on the top surface, the electrodes can be wire-bonded to the two separate contact pads. The top surface of the contact pads can be roughened or protruded to increase adhesion between the protective glue and the contact pads. The contact pads can also have tunnels at the bottom surface to increase the gluing interface between the contact pads and the glue.
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