Wing-shaped surface mount package for light emitting diodes

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United States of America Patent

SERIAL NO

10051923

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Abstract

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The bottom metal contacts of a surface mount LED are extended wider than the glue covering the LED. The extensions provide more area for soldering to a motherboard. The glue contains material to change the color of the light emitted from LED to be different from that emitted from the LED. Colorless light can be emitted when blue or UV LED is used.

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Patent Owner(s)

Patent OwnerAddress
HARVATEK CORPNO 18 LANE 522 SEC 5 CHUNG HUA ROAD HSIN-CHU ROC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Bill Hsin-Chu, TW 21 215
Wang, Bily Hsin-Chu, TW 186 1617

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