Method of forming gate electrode in semiconductor devices
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United States of America Patent
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Issued Date -
Jun 13, 2002
app pub date -
Dec 3, 2001
filing date -
Dec 8, 2000
priority date (Note) -
Abandoned
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Abstract
The present invention relates a method of forming a gate electrode in semiconductor devices by which given regions of the hard mask layer, the tungsten film and the tungsten nitride film, and a given thickness of the polysilicon film are etched to form the spacer at the sidewall of the first pattern, a spacer is formed at the sidewall of the first pattern and the remaining polysilicon film and gate oxide film are etched using the first pattern at the sidewall of which the spacer is formed as a mask to form a dual gate electrode. Therefore. the present invention can prevent oxidization of a tungsten film without implementing a selective oxidization process. Further, the present invention can prevent intrusion of boron ions implanted into a polysilicon film into a gate oxide film by not performing the selective oxidization process.
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