Tightening rings for integrated circuit tester heads
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jun 27, 2002
app pub date -
Oct 26, 2001
filing date -
Apr 24, 1997
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to an assembly ring, on a test head, of a wafer that provides an interface of electric contact transfer between the test head and a circuit to be tested, including a disk, open in its central portion and meant for supporting the periphery of the wafer; a removable collar assembly of the ring on the test head; and means for rotatably connecting the disk in the vicinity of a free end of the collar.
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