Method and device for protecting micro electromechanical systems structures during dicing of a wafer
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United States of America Patent
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Sep 20, 2005
Grant Date -
Jun 27, 2002
app pub date -
Dec 5, 2001
filing date -
Dec 5, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A wafer cap protects micro electromechanical system ('MEMS') structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
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