IC package pressure release apparatus and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 10, 2007
Grant Date -
Jul 4, 2002
app pub date -
Dec 29, 2000
filing date -
Dec 29, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.
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