Heat dissipation structures for integrated lead disk drive head suspensions
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United States of America Patent
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-
Oct 28, 2003
Grant Date -
Jul 11, 2002
app pub date -
Jan 10, 2001
filing date -
Jan 10, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A head suspension or head suspension component that includes a spring metal support layer, an insulating layer and a conductive layer, into which three dimensional heat dissipation structures have been integrally formed to dissipate heat from the head suspension, especially in an area adjacent to an integrated circuit mounted on the head suspension. The heat dissipation structures may include a plurality of heat fins formed into or onto one or more conductive traces of the conductive layer, or may include a plurality of projections or indentations formed into or onto conductive traces. Use of a partial etching technique allows for simultaneous etching of both the traces and the heat fins within the traces, thereby decreasing production costs and increasing head suspension reliability. Heat fins may also be formed into the support layer in a region adjacent to the conductive layer heat fins, if desired in order to dissipate even more heat from the region.
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