Importance

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Abstract

A single sided module comprising a substrate which defines opposed first and second sides and includes a conductive pattern thereon. In addition to the substrate, the module comprises at least two chip stacks which are disposed on only the first side of the substrate and electrically connected to the conductive pattern. The chip stacks are placed into electrical communication with each other by the conductive pattern. The conductive pattern itself comprises a multiplicity of conductive pads which are disposed on only the first side of the substrate, and a multiplicity of conductive traces which electrically connect respective pairs of the conductive pads to each other. The conductive traces are themselves disposed on and extend along only the first side of the substrate, with the chip stacks being electrically connected to respective sets of the conductive pads.

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First Claim