Re-release adhesive and re-release adhesive sheet

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7641966
APP PUB NO 20020091173A1
SERIAL NO

10013543

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A curable re-release adhesive which, when subjected to a curing reaction caused by irradiation with radiation, shows a sufficient drop of adhesion and causes the adherend to be warped to a minimized extent as developed by the shrinkage force caused by the curing reaction. The re-release adhesive contains a radiation-reactive polymer including a main chain and a plurality of intramolecular side chains, each such side chain having a terminal carbon-carbon double bond, a chain length of 6 or more in terms of number of atoms, and the same or a different number of atoms as each other side chain in the polymer. The release adhesive shows a shrinkage force of 30 MPa or less as developed by a curing reaction upon irradiation. A re-release adhesive sheet is also disclosed, including a substrate film and an adhesive layer containing the re-release adhesive, provided on one surface thereof.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATIONIBARAKI-SHI OSAKA 567-8680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akazawa, Koji Osaka, JP 14 154
Fukuoka, Takahiro Osaka, JP 94 531
Hashimoto, Kouichi Osaka, JP 41 348
Kubozono, Tatsuya Osaka, JP 4 110
Nakagawa, Yoshio Osaka, JP 53 527

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