Flip chip packaged semiconductor device having double stud bumps and method of forming same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jul 18, 2002
app pub date -
Jan 15, 2001
filing date -
Jan 15, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor device including a substrate having a contact pad with a first stud bump formed thereon and an integrated circuit having a contact pad with a second stud bump formed thereon. In this semiconductor device, the first stud bump is bonded to the second stud bump, thereby connecting the integrated circuit to the substrate.
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