Importance

Loading Importance Indicators...

Abstract

An optical device module, for example, an LED array module or photosensor module, includes a plurality of optical devices electrically attached to contact lands on a substrate by a plurality of electrically conductive hard particles and mechanically attached by a non-electrically conductive bonding adhesive. The optical device module may further include a cover that is transparent to the light emitted or detected by the optical devices and that has electrically conductive contact pads on an inner surface thereof, which are bonded to bond pads on a face surface of the optical devices. A process for fabricating an optical device module includes electrically connecting the optical device to the electrical contact land on the substrate by attaching a plurality of electrically conductive hard particles to either the base surface of the optical device or to the electrical contact lands. An adhesive is applied to one of the mounting substrate or a contact land overlying the substrate or both, and the optical device is placed on the contact land and the adhesive is cured.

Loading the Abstract Image...

First Claim