Shielded carrier for land grid array connectors and a process for fabricating same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Jul 25, 2002
app pub date -
Feb 12, 2002
filing date -
Aug 24, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides a carrier with electrical shielding of individual contact elements, resulting in LGA interposer connectors with improved electrical performance. The carrier includes a plurality of openings, each of which may contain an individual contact element. The openings may be plated with conductive material, and may also be commoned to one or more reference voltages (e.g., ground) present on at least one conductive layer of the carrier. The carrier may be as simple as a single unified structure with a conductive layer on one outer surface, or much more complex, having many layers of dielectric and conductive material. The carrier may also provide improved retention of the individual contact elements. The process to assemble one embodiment of the carrier is also disclosed.
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