CONNECTOR MOLDING METHOD AND SHIELDED WAFERIZED CONNECTOR MADE THEREFROM
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United States of America Patent
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Jun 25, 2002
Grant Date -
Jul 25, 2002
app pub date -
Jan 25, 2001
filing date -
Jan 25, 2001
priority date (Note) -
Granted
status (Latency Note)
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Abstract
A high speed, high density electrical connector. The connector is assembled from wafers. Each wafer is formed by molding a first dielectric housing over a shield plate. Signal contacts are inserted into the first dielectric housing and a second housing is overmolded on the first housing. Features are employed to lock the first and second housings together with the shield plate to provide a mechanically robust subassembly. The connector as formed has a good electrical properties, including precise impedance control and low cross talk.
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