Electropolishing and chemical mechanical planarization
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Aug 8, 2002
app pub date -
Nov 20, 2001
filing date -
Nov 20, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Removing metal from a semiconductor substrate by dissolving ions of the metal into an electrolyte, comprising the steps of: applying a voltage across a polishing pad and the substrate, while an electropolishing electrolyte is dispensed at an interface of the substrate and the polishing pad, and while pooling the electrolyte about the substrate by the polishing pad.
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