Planarizing interposer for thermal compensation of a probe card
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United States of America Patent
Stats
-
Jun 29, 2004
Grant Date -
Aug 15, 2002
app pub date -
Jan 29, 2002
filing date -
Jan 31, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A probe card assembly that compensates for differing rates of thermal expansion is disclosed herein. The assembly is comprised of a multi-layered dielectric plate interposed between a probe head and a printed circuit board. The printed circuit board has arrayed upon its surface a first plurality of electrical contacts arranged in a pattern. The dielectric plate has a second plurality of electrical contacts arranged in a pattern matching the first plurality of contacts. A planarizing interposer is interposed between the plate and the printed circuit board and has a pattern of holes matching the pattern of electrical contacts on the printed circuit board and plate. The assembly further includes a plurality of electrical connectors disposed within each of the holes arrayed in a pattern upon the planarizing interposer a plurality conductive bumps or fuzz buttons making electrical contact with the first and second plurality of electrical contacts.
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