Method for supporting sensitive workpieces during processing
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United States of America Patent
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N/A
Issued Date -
Aug 22, 2002
app pub date -
Feb 21, 2001
filing date -
Feb 21, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of supporting an object having an even contact surface during manufacturing operations, by urging it to a rigid substrate, the contact surface facing a supporting surface of said substrate, for use in an environment containing particles that are likely to be entrapped between the object and the substrate. The method includes provision of a supporting surface in the form of a plurality of bulges disposed on the substrate with depressions therebetween. The bulges have crests with rounded profile enabling the entrapped particles to fall into the depressions, thereby reducing the probability of causing mechanical damage to the object and/or of a faulty manufacturing operation on the object.
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