Method and apparatus to package and electrically connect to a microdisplay
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Aug 22, 2002
app pub date -
Jan 14, 2002
filing date -
Nov 17, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides a method and apparatus to package and electrically connect a microdisplay that includes a cavity package design. This cavity package design improves the packaging of the microdisplay by using a low number of parts, less processing, and is independent of the customer's interconnect. Structurally, the invention is a unified part, forming a cavity for insertion of a microdisplay cell. Additionally, the cavity package incorporates a variety of test features for ease of testing. Also, the cavity package is a small size and includes multiple mounting options allowing flexibility to customer changes and multiple configurations.
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