US Patent Application No: 2002/0114,143

Number of patents in Portfolio can not be more than 2000

Chip-scale packages stacked on folded interconnector for vertical assembly on substrates

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Importance

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Abstract

A vertical stack of semiconductor devices is formed by folding a strip-like flexible interconnector assembled with integrated circuit chips, packages and/or passive components and attaching coupling members solderable to other parts (FIGS. I4A and I4B).

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TEXAS INSTRUMENTS INCORPORATEDDALLAS, TX17098

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Edwards, Darvin R Garland, TX 23 450
Morrison, Gary P Garland, TX 14 56
Stark, Leslie Dallas, TX 1 31

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
OVID DATA CO. LLC (14)
7,485,951 Modularized die stacking system and method 1 2003
7,542,304 Memory expansion and integrated circuit stacking system and method 0 2004
7,371,609 Stacked module systems and methods 2 2004
7,586,758 Integrated circuit stacking system 2 2004
7,335,975 Integrated circuit stacking system and method 0 2004
7,595,550 Flex-based circuit module 3 2005
7,495,334 Stacking system and method 2 2005
7,524,703 Integrated circuit stacking system and method 1 2005
7,310,458 Stacked module systems and methods 4 2005
7,656,678 Stacked module systems 0 2005
7,323,364 Stacked module systems and method 0 2006
7,417,310 Circuit module having force resistant construction 3 2006
7,572,671 Stacked module systems and methods 0 2007
7,804,985 Circuit module having force resistant construction 0 2008
 
APPLE INC. (4)
7,869,206 Handheld computing device 7 2008
8,250,724 Method for handheld computer device 1 2010
8,427,379 Modular material antenna assembly 0 2010
8,391,010 Internal frame optimized for stiffness and heat transfer 0 2010
 
INTEL CORPORATION (3)
7,017,638 Forming folded-stack packaged device using vertical progression folding tool 0 2002
6,992,376 Electronic package having a folded package substrate 2 2003
7,514,773 Systems and arrangements for interconnecting integrated circuit dies 1 2006
 
STAKTEK GROUP L.P. (2)
7,719,098 Stacked modules and method 2 2007
7,626,273 Low profile stacking system and method 0 2009
 
DONGBU ELECTRONICS CO., LTD. (1)
7,087,459 Method for packaging a multi-chip module of a semiconductor device 11 2003
 
Enthorian Technologies, LP (1)
7,606,048 Integrated circuit stacking system 2 2004
 
HONEYWELL INTERNATIONAL INC. (1)
7,790,502 Method of manufacturing flexible semiconductor assemblies 1 2007
 
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (1)
7,885,079 Flexible electronic assembly 1 2006
 
INFINEON TECHNOLOGIES AG (1)
8,350,382 Semiconductor device including electronic component coupled to a backside of a chip 0 2007
 
NEC CORPORATION (1)
8,093,706 Mounting structure of semiconductor device and electronic apparatus using same 0 2009
 
SAMSUNG ELECTRONICS CO., LTD. (1)
7,923,291 Method of fabricating electronic device having stacked chips 0 2009
 
SONY CORPORATION (1)
7,692,102 Electronic circuit device 0 2005