Reworkable encapsulant
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Aug 29, 2002
app pub date -
Oct 22, 2001
filing date -
Apr 28, 1999
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides an improved fluorinated polymer encapsulant for protectively coating electronic devices in an electronic device module. Also provided is a method for applying and reworkably removing the same to and from the electronic device module. In one embodiment, a coating of a fluorinated polymer solution is applied to at least a portion of an electronic device module. The module is then baked to operably fix to it the fluorinated polymer coating.
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