Heat sink
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United States of America Patent
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-
N/A
Issued Date -
Sep 19, 2002
app pub date -
Aug 24, 2001
filing date -
Mar 16, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A composite heat sink devise includes a heat sink body formed of aluminum, the body having a pair of coplanar surfaces, and a thermally conductive solderable element, for example of copper, mechanically fixed to each of the coplanar surfaces. Each of the solderable elements has a first surface which is contiguous with one of the coplanar surfaces, and a second surface which is soldered to a printed circuit board.
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Family
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Cited Art Landscape
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