Polishing method for selective chemical mechanical polishing of semiconductor substrates
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 19, 2002
app pub date -
Jan 12, 2001
filing date -
Jan 12, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A chemical mechanical polishing method is provided for polishing substrates with one or more barrier layers on an underlying dielectric layer utilizing a polishing composition with a high selectivity for removal of the barrier layer material (for e.g. tantalum) resulting in a substrate with a planar dielectric layer with minimal scratching and erosion.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully