Resin composition for photofabrication of three dimensional objects
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United States of America Patent
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app pub date -
Oct 18, 2001
filing date -
Apr 19, 1999
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Abandoned
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Abstract
Photocurable resin composition for photofabrication of three-dimensional objects comprising (A) 5-80 parts by weight of an oxetane compound, (E) 5-80 parts by weight of an epoxy compound, (C) 0, 1 10 parts by weight of a photoacid generator, (D) 1-35 parts by weight of elastomer particles with an average particle diameter of 10-700 nm, (E) 0-35 parts by weight of a polyol compound, (F) 0-45 parts by weight of an ethylenically unsaturated monomer, and (G) 0-10 parts by weight of a radical photopolymerization initiator.
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