Photoresist compositions comprising polycyclic polymers with acid labile pendant groups
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United States of America Patent
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Issued Date -
Sep 26, 2002
app pub date -
Feb 19, 2002
filing date -
Mar 7, 1996
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a radiation sensitive photoresist composition comprising a photoacid initiator and a polycyclic polymer comprising repeating units that contain pendant acid labile groups. Upon exposure to an imaging radiation source the photoacid initiator generates an acid which cleaves the pendant acid labile groups effecting a polarity change in the polymer. The polymer is rendered soluble in an aqueous base in the areas exposed to the imaging source.
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